Laser Cutting

Laser cutting and micro-cutting can be applied to a wide variety of material types and formats. Laser cutting is used to produce features from a few microns to many metres in metals and polymers, and materials that are difficult to machine by conventional methods, such as hard materials like diamond or very delicate films.

The unique characteristics of the laser cutting process can be used to great advantage when processing laminated or multi-layer materials. Not only will the laser process cope with processing through multiple layers with different material properties but it is also often possible to selectively cut one layer in a stack without cutting others.

Through a combination of the laser micromachining process and precision scanning and translation techniques, it is possible to cut highly complex and intricate profiles in flat, curved and complex shaped parts. This includes cutting profiles on wires and optical fibers, processing tubes and cylinders, plus flat sheets and material fed from a roll or spool.

Utilising our wide range of laser types, covering the spectrum from UV to IR, and many years of processing experience, OpTek can address your precision cutting requirements from prototype level through to full-scale production.

Laser Cut SensorMulti-layer materials can be laser cut through without the loss of definition or delamination of the individual layers, even with very thin or delicate materials.

Laser CuttingLaser cutting can be applied to materials that are susceptible to damage from mechanical stress or impact.  The non-contact process exerts little or no mechanical stress to the substrate.

Laser Cutting diamondMaterials that can be processed by laser cutting include: Alloys, steels, copper, aluminium, tungsten, titanium, diamond, alumina, zirconia, green ceramics, PZT, silicon nitride, tungsten carbide, polyimide, polyethylene, PMMA, Kapton, Vespel, Cirlex, ABS, sapphire, quartz and glass.


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