Laser scribing and thin film scribing is well suited to the creation of fine lines and other blind features and patterns on a wide range of substrates, thin films and coatings. Laser scribing encompasses a number of terms including micro scribing and thin film scribing and is used to create precisely controlled, fine scale grooves or write fine lines into films and coating layers. Laser energy can be applied to the material in one of two ways, either focused to a small spot and scanned over the surface or imaged through a mask to project the pattern onto the surface. The use of laser scribing allows for very accurate writing of fine features both in the surface of a material and by the removal of one or more layers in a multi-layer substrate.
Through the use of precision laser processing it is possible to selectively target individual layers in thin film devices, to create a highly versatile patterning process. The laser process can be tuned to remove one deposited layer from another or from the underlying substrate, without compromising the layer or material below. Through careful selection of the laser type and process parameters virtually any material can be scribed, including those that are highly reflective or transparent.
Laser scribing and selective layer processing of precisely controlled structures can be achieved in the majority of materials, including transparent coatings on transparent substrates such as those used in the display and Photovoltaic industries.
Selective laser machining allows for the removal of metallic layers and coatings with little or no machining of the underlying substrate. Very fine lines can be written to create high density circuitry and functional or decorative patterns.