Laser Scribing & Patterning

Laser scribing is well suited to the creation of fine lines and other blind features and patterns. Laser energy can be applied to the material in one of two ways, either focused to a small spot and scanned over the surface or imaged through a mask to project the pattern onto the surface. The use of laser scribing allows for very accurate writing of fine features both in the surface of a material and by the selective removal of one or more layers in a multi-layer substrate.

fingerprintsensor25Laser processing of precisely controlled structures can be achieved in the majority of materials through the careful selection of the laser wavelength and output characteristics.

demetalpattern3Selective laser machining allows for the removal of metalic layers and coatings with little or no machining of the underlying substrate. Very fine lines can be written to create high density circuitry and decorative patterns.

demetaltrack4Thin oxide layers on flexible and rigid materials may be be patterned to determine conductive and non-conductive areas.

airbearingface8Laser micromilling is applied to create features in flat or contoured surfaces. Beam scanning, mask imaging or a combination of the two provides great flexibility in the range of features that may be produced.

Scribing & Patterning

Precision

  • <1μm depends on technique

Feature Sizes

  • To <5μm (material dependent)

Coatings removed

  • Metals, oxides, polymers

Substrate materials

  • Polymer, composite, ceramic, metal, glass

Materials Handling

  • x-y batch loading
  • Rotating drum
  • Reel-to-reel

Available Lasers

  • Solid State - 266nm, 355nm, 532nm, 1μm
  • Excimer - 248nm, 308nm
  • CO2 - 10.6μm, 9.4μm

Beam Handling

  • Galvo scanning
  • Spinning mirror
  • Mask imaging

Inspection

  • On-line high magnification vision inspection
  • Off-line SEM, AFM inspection

QA

  • QCP and SPC as required
  • Traceability to National Standards as required
  • This field is for validation purposes and should be left unchanged.