Laser Processing PV Cells

Laser Processing PV Cells for precision machining of thin films, foils and wafers.

Laser processing PV cells is applicable to a wide range of PV technologies, to create isolation scribes in thin film and wafer bases cells, drillling micro vias and a host of other precision processing tasks.  OpTek is a leading provider of laser based production solutions and offers a detailed understanding of the process requirements for a wide range of PV cell manufacturing steps. Resources include access to all major laser sources in both well established and the latest technologies, along with expert knowledge in the application of these tools in Si wafer-based cells, thin film on glass and flexible metal foils and polymer films.

Scribing Scribing

The dominant application for lasers in PV cell manufacture, scribing is applied to Si wafer and thin film formats for patterning layers of metal, insulating oxides, TCO, semiconductors and polymers.

Cutting and drilling Cutting & Drilling

partial and full thickness processing of substrates is applied for a number of requirements such as via holes for EWT and interconnects, wafer or substrate re-sizing and for trimming encapsulants.

Mircomachining Micromachining

Laser processing can be applied to a wide range of requirements. These include marking for product identity, welding of hermetic seals, local treatment on contact areas and contact attachment.

 

To discuss your specific laser processing requirement please contact OpTek Systems

Laser Processing PV Cells

Process

  • Scribing/patterning
  • Hole/via drilling
  • Cutting/trimming
  • welding, contact firing
  • Marking

Application

  • P1,P2,P3 layer scribing
  • Scribing burried contacts
  • Scribing TCO's
  • Removing insulating oxides
  • Edge deletion
  • Edge isolation
  • Emitter wrap through
  • Contact firing
  • Encapsulation finishing
  • Wafer re-sizing

Cell Types

  • c-Si wafer
  • CIS
  • CIGS
  • CdTe
  • DSSC
  • BIPV
  • Flex Thin film

Laser Options

  • DPSS 1064, 532, 355,266nm
  • Fiber Laser 1064, 532nm
  • CO2 10.6, 9.4µm

Substrate Format

  • 6" Si Wafer
  • Glass sheet
  • Polymer film
  • metal foil
  • Hybrid (BIPV)
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