Laser Dicing

Laser dicing from OpTek Systems is used for a range of requirements from the singulation of micro-electronic devices to the re-sizing of wafers or substrates. With a diverse range of laser parameters available to us we are able to apply laser dicing to materials including silicon, ceramic, diamond, polymers and composites, making it suitable for applications including electronics, micro-electronics, photovoltaics and plastic electronics. As there are no blades or mechanical contact involved with laser processing, chips and cracks associated with mechanical processing are avoided, furthermore there is no mechanical wear to worry about.  Laser dicing can be configured either for through cutting or for partial thickness cutting and can achieve narrow street width at high feed rates.

Laser DicingLaser dicing of materials like silicon and polymer, making it suitable for conventional and plastic micro-electronics.  Laser processing provides an alternative to conventional mechanical sawing, with the added flexibility to meet the challenges of new developments in electronics.

Laser DicingFull thickness (through) cutting provides the flexibility to create curves, circles and other non-straight profiles, in addition to the more conventional straight line cuts. Through cutting also makes it possible to dice out sections, or devices from the centre of a wafer, without damage to the surrounding material.

Laser diced diamondLaser dicing can also be applied to virtually any material, addressing applications for ceramic, diamond and other super-hard materials.

Wafer resizingPartial thickness laser dicing provides fast, accurate and reproducible processing of a substrate, which can then be reliably cleaved or snapped into individual die.  This scribe and snap approach delivers the advantages of high speed, narrow kerf processing, with minimized machining debris and low thermal impact.

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