OpTek’s Laser Cleaving produces optical-quality facets on SM, MM, large-core and PM fibers and waveguides. It is the process of choice for large-volume applications for FTTH and automotive applications. It also has the flexibility to make it the ideal method for development and prototype quantities.
Laser Cleaving allows ribbons to be processed quickly, reliably and with a range of cleave angles and lengths which can vary from fiber-to-fiber.
Laser Cleaving also allows cleaving close to other structures such as v-groove arrays and ferrules, with protrusions measured in microns.
Laser Cleaving is well suited to non-round fibers, with square and rectangular sections being easily accommodated for high-power and sensor applications.
In all cases, the speed of the Laser Cleave process gives unbeatable cost-effectiveness.
Precise Cleave Position
High Damage Threshold