Scribing & Patterning
Scribing & Patterning
Precision
- <1μm depends on technique
Feature Sizes
- To <5μm (material dependent)
Coatings removed
- Metals, oxides, polymers
Substrate materials
- Polymer, composite, ceramic, metal, glass
Materials Handling
- x-y batch loading
- Rotating drum
- Reel-to-reel
Available Lasers
- YAG - 266nm, 355nm, 532nm, 1μm
- Excimer - 248nm, 308nm
- CO2 - 10.6μm, 9.4μm
Beam Handling
- Galvo scanning
- Spinning mirror
- Mask imaging
Inspection
- On-line high magnification vision
inspection - Off-line SEM, AFM inspection
QA
- QCP and SPC as required
- Traceability to National Standards as required
Laser processing is well suited to the creation of fine lines and other blind features and patterns. Laser energy can be aplied to the material in one of two ways, either focused to a small spot and scanned over the surface or imaged through a mask to project the pattern onto the surface. The use of a laser allows for very accurate writing of fine features both in the surface of a material and by the selective removal of one or more layers in a multi-layer substrate.
Laser processing of precisely controlled structures can be achieved in the majority of materials through the careful selection of the laser wavelength and output characteristics.
Selective laser machining allows for the removal of metalic layers and coatings with little or no machining of the underlying substrate. Very fine lines can be written to create high density circuitry and decorative patterns.
Thin oxide layers on flexible and rigid materials may be be patterned to determine conductive and non-conductive areas.
Laser micromilling is applied to create features in flat or contoured surfaces. Beam scanning, mask imaging or a combination of the two provides great flexibility in the range of features that may be produced.
Whether you're looking to develop a new process, sub-contract your existing production or procure laser processing tools for in-house manufacture, contact OpTek to discuss how we can help.