Cutting & Drilling

Cutting & Drilling

Precision

  • x-y precision to <1μm over 400x400mm

Drilling Hole Sizes

  • To <5μm (material dependent)

Hole Aspect Ratio

  • Up to 100:1 (material dependent)

Materials

  • Polymer, composite, ceramic, metal, glass

Materials Handling

  • x-y batch loading
  • Rotating drum
  • Reel-to-reel

Available Lasers

  • YAG - 266nm, 355nm, 532nm, 1μm
  • Excimer - 248nm, 308nm
  • CO2 - 10.6μm, 9.4μm

Inspection

  • On-line high magnification vision
    inspection
  • Off-line SEM, AFM etc inspection
QA
  • QCP and SPC as required
  • Traceability to National Standards as required

OpTek provides a responsive and efficient laser-processing and micromachining service from locations in the US and UK. Utilising its wide range of laser types from UV to IR, and many years of processing experience, OpTek can address your machining requirements from prototype level through to full-scale production.

 

Laser Processing & Micromachining > Laser Drilled Swirl Plate > Small (120 x 89)Laser micro-machining of precision profiles, including the trepanning and drilling of round holes in a range of marterials.


Laser Processing & Micromachining > Laser drilled 4um holes in steel > Small (120 x 70)High aspect ratio holes and tightly-packed hole arrays.


Laser Processing & Micromachining > Diamond Chip > Small (120 x 145) Component processing to customer-specific quality criteria, can include post process testing including microscopic inspection, flow testing, chemical or electrical testing.

 


More information

Whether you're looking to develop a new process, sub-contract your existing production or procure laser processing tools for in-house manufacture, contact OpTek to discuss how we can help.